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e-beam inspection on the list of
equipment critical for leading-edge
device manufacturing.”
The eSL10 e-beam inspection
system features several revolutionary
technologies that power its ability to
close critical defect detection gaps. A
unique electron optics design produces the industry’s highest landing
energy and the industry’s widest
operating range for defect capture
across a variety of process layers
and device types. These innovative
optics also deliver high beam current
density at a small spot size, essential
for high sensitivity inspection of
advanced devices at high throughput.
Yellowstone™ scanning mode uses
10 billion pixels of information per
scan to support high speed operation
without compromising resolution, for
efficient investigation of suspected
hotspots or defect discovery within a
broad area. Simul-6™ sensor technology collects surface, topographic,
material contrast and deep trench
information in one scan, reducing the
Multiple breakthrough technologies deliver the eSL10’s high
resolution, high speed e-beam inspection performance.
time required to identify different
defect types within challenging
device structures and materials. With
its advanced Artificial Intelligence
(AI) system, the eSL10 employs deep
learning algorithms that adapt to IC
manufacturers’ evolving inspection
requirements, isolating the defects
most critical to device performance.
Three-dimensional device architectures — such as 3D NAND and
DRAM for memory, and finFET and
gate all around (GAA) transistors for
logic — are requiring fabs to rethink
traditional defect control strategies.
The combination of the eSL10 with
KLA’s flagship 39xx (“Gen5”) and
29xx (“Gen4”) broadband optical
wafer defect inspection systems
creates a powerful defect discovery
and monitoring solution for advanced IC technologies. Together
these systems accelerate yield and
reliability, finding critical defects
faster and enabling quicker resolution of defect issues from R&D to
production.
Extendibility is built in to the new
eSL10 platform to allow for application expansion throughout the
e-beam inspection and metrology
space. Several eSL10 systems are in
operation at leading logic, memory,
and original equipment manufacturers worldwide, where they are
helping to develop, ramp and monitor
manufacturing of next-generation
processes and devices.
EV Group Completes Construction of State-ofthe-art Cleanroom Facility at Corporate HQ
EV Group (EVG), a leading supplier
of wafer bonding and lithography
equipment for the MEMS, nanotechnology and semiconductor markets,
has completed construction of its
new Cleanroom V building at its corporate headquarters in Austria. Built
from top to bottom with the latest
cleanroom design and construction
technology, the new building nearly
doubles the cleanroom capacity at
EVG’s headquarters, and will be
used for product and process
development, equipment
demonstrations, prototyping
EV Group’s new Cleanroom
V facility nearly doubles
the cleanroom capacity
at EVG’s HQ and houses a
modern training center with
multiple dedicated areas for
customer and field engineer
training.
10 | Tuesday, July 21www.semiconductordigest.com
