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SVXR Introduces Strategies for Sub-surface
Inspection of Advanced Packages
SVXR, Inc. a supplier of
inspection and metrology
technology, will join the Test
Vision Symposium at the 50th
edition of SEMICON WEST
this year. SVXR’s Chief Operating Officer, Scott Jewler will
present sub-surface inspection
strategies to improve time
to market, increase yields,
and reduce costs associated
with high density solder
interconnect in advanced
packaging.
While 100% Automatic Optical Inspection (AOI) has been
widely deployed in advanced
packaging process flows,
solder interconnect quality
cannot be inspected optically. To
address this market demand, SVXR
introduced the X200TM, a unique
High-resolution Automated X-ray Inspection (HR-AXI) system designed
to automatically detect defects at
high-speed in advanced IC packages.
Since its launch in 2019, the X200™
has been successfully deployed at
multiple customer sites in the most
demanding applications including
AI, IOT, 5G, and cloud computing
where challenging assembly processes must be tightly controlled
and monitored.
Human inspection of traditional
point projection X-ray images
with limited dynamic range is
error prone and time consuming.
HR-AXI produces high resolution
data rich images that are sensitive
to sub-micron changes in material
thickness. Using AI, defects can
be detected and classified in real
time from a single top down image
without the need for a human operator greatly increasing throughput
and quality.
The HR-AXI instrument was
designed to bridge the gap between
AOI and traditional point projection
X-ray by enabling sub-surface high
speed inspection and metrology. The
X200™’s proprietary technology
safely produces a large field of
view image with high-resolution for
automated analysis and reporting,
with throughput that is orders of
magnitude faster than existing subsurface inspection techniques.
Solid State Technology Contents Available
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