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System-level
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the standard as the most compact turbopump in its class.
The DN 320 flange size increases the pumping speed
for process gases by up to an impressive 30%. Its unique
bearing concept and specially coated rotor design protect
both the process and the pump, providing unparalleled
durability and reliability.
TORRI BD 0100/0600 dry pumps: TORRI BD from
Busch Vacuum Solutions offer short pump down times for
load lock chambers and are among the smallest, lightest and
most energy-efficient dry multi-stage rotary lobe vacuum
pumps on the market.
CT-TW-H thermal abatement: The high-temperature
thermal abatement system from centrotherm clean solutions
combines the wide process coverage of flame abatement
with the fuel-free aspects of plasma abatement, with lower
operating costs and secondary emissions. Able to destroy
the molecular process gas NF3 at class-leading levels with
extremely low NOx emissions, the CT-TW-H finally delivers
a sustainable solution with a minimal carbon footprint to the
CVD and metal-etch process family.
www.semiconductordigest.com
Resonac Announces New
US-JOINT Consortium
Resonac Corporation unveiled a new consortium
of ten partners, called “US-JOINT,” for its semiconductor back-end process R&D in Silicon
Valley. The ten American and Japanese semiconductor materials and equipment companies
are: Azimuth; KLA; Kulicke & Soffa; Moses
Lake Industries; MEC; ULVAC; NAMICS; TOK;
TOWA; and Resonac.
US-JOINT expands the activities of Japan-based
open consortiums led by Resonac in the U.S. and
includes the participation of five U.S.-based companies. US-JOINT R&D will take place at a new
R&D center in Union City, Calif., set up through
co-investment with the partners. The construction
of cleanrooms and equipment installation will
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begin this year, and the facility
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