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Scia Systems Highlights Advances in Ion
Beam Processing
scia Systems GmbH, an industry
leader in advanced ion beam and
plasma process equipment for microelectronics, MEMS, and precision
optics industries is highlighting key
advances in ion beam processing for
semiconductor, sensor and photonic
integrated circuit (PIC) manufacturing at this year’s SEMICON West.
According to Dr. Michael Zeuner,
CEO of scia Systems, “As semiconductors, sensors, and optical devices
increase in complexity due to smaller
features, new exotic materials, and
more layers and complex structures, the
processes used to manufacture them
require higher levels of precision. Our
advances in ultra-precision ion beam
process technologies are enabling
manufacturers’ success in producing
these devices, which are driving cloud
computing, augmented/mixed reality
(AR/MR), automotive, telecommunications, and many other industries. A
case in point, every modern cell phone
has components that have been manufactured using a scia Systems product.
We look forward to highlighting these
solutions, as well as the many highgrowth applications that they enable, at
SEMICON West – the premier event for
the semiconductor ecosystem.”
Demand for PICs is growing
rapidly in telecommunications and
data centers due to their wide bandwidth, low transmission loss, and
numerous other advantages over
traditional electronic integrated
circuits. Integrating new materials, material stacks, and designs
requires new etching solutions.
scia Systems’ advanced ion beam
etching and trimming processes
18 | Wednesday, July 10
enable manufacturing of
three-dimensional optoelectronic microstructures
for PICs, such as waveguides and other optical
components. Reducing
Uniformity improvement of PICs made of
microroughness by ion
Si3N4 using ion beam trimming; pre- and
beam trimming is another post-trimming results show an improvement
promising application
factor of more than 20.
area that enhances the
production of high-performance
its high-precision ion beam etching
PICs. Further applications include
technology, enabling the manunano-structured surface relief
facture of high-performance GMR
gratings for AR/MR systems, and
sensors for flexible and wearable
surface form error correction for
electronics, including AR/MR
telescope mirrors, X-ray optics,
headsets, and TMR sensors for
lenses, and conventional optics.
Internet of Things (IoT), automotive,
High-precision sensors that use
smart home, eMobility, and many
other applications.
Reverse engineering
scia Trim 200 — Highis an essential step
volume production
in semiconductor
system for film
manufacturing. By
thickness correction of
conducting verification,
wafers up to 200 mm.
failure analysis, and
research of internal
magnetic storage, most notably giant device structures, engineers can
magnetoresistance (GMR) and tunnel isolate and troubleshoot problems
magnetoresistance (TMR) sensors,
to improve manufacturing yields.
are used to detect any type of motion Reverse engineering involves
including proximity, rotations or
exposing internal components,
vibrations. These have been rapidly
delayering to analyze each layer of
adopted across a wide variety of
the device, imaging, and post-proindustries and applications, including cessing. Conventional delayering
automotive electronics, industrial
processes such as wet chemical
equipment, and cloud storage.
etching, CMP or plasma etching are
However, the complex, multi-layer
often expensive, error-prone, and
composition of these sensors creates
limited in application. scia Systems’
significant challenges for traditional
ion beam etching technology
chemical and dry etching processes,
enables precise processing within
which have difficulty processing
the micro- and nanometer-size range
magnetic materials. scia Systems
and atomic-level-thickness range for
overcomes these limitations with
different materials at once.
www.semiconductordigest.com
