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SecureFoundry
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a different class altogether, built for both advanced and
legacy nodes, throughput and reliability.”
Unlike traditional photolithography, which requires
costly masks and has long lead times, HBA lithography
uses 65,000 parallel electron beams to pattern wafers
directly. Each beam is independently controlled. The
system scans the wafer in two passes, automatically
compensating for any missed pattern, ensuring reliability and consistency across the system as well as
enabling fine-grained control and high-fidelity pattern
placement. This architecture is specifically optimized
for mixed-volume manufacturing and security-critical
use cases where flexibility, traceability and repeatability are paramount.
The SecureFoundry HBA lithography system supports
research institutions, defense contractors and commercial
partners seeking agile, onshore solutions. The tool fills a
gap in the semiconductor supply chain between design,
research and development, and commercial production,
enabling highly custom chip designs. It is optimized for
nodes between 22nm and 65nm, can print on 100mm to
300mm substrates, and can pattern silicon or compound
silicon substrates. Its software-defined patterning architecture enables design flexibility, while built-in die-level
traceability and digital provenance address growing
requirements around trusted supply chains and device
authentication.
“For defense and security applications, every die must
be accounted for,” said Keen. “This system gives us a
fully auditable chain of custody from design to wafer.”
The HBA lithography system integrates seamlessly
with existing industry-standard EDA workflows while
also offering design optimization for customers requiring
accelerated iteration or advanced security constraints.
The system also allows for hybrid processing capabilities. Some layers of a device may benefit from
traditional mask-based lithography methods, while
others gain speed and cost advantages through HBA
lithography. SecureFoundry’s platform adapts to fit
the customer’s node, production volume and budget,
unlocking further flexibility for engineers.
The HBA lithography system is operated exclusively
within U.S.-based, secure facilities, ensuring compliance
with all defense and export control regulations.
DAS Environmental Experts Group Expands in AZ
DAS Environmental Experts Group (Booth 450), a
leading global provider of environmental technologies
for waste gas and water treatment, officially opened its
new Innovation & Support Center (ISC) in Glendale,
Arizona. Initiated and built by
DAS US, the Group’s American
branch, the center represents a significant milestone in the company’s
North American growth strategy. It
strengthens the organization`s proximity to U.S. customers while creating
jobs and contributing to Arizona’s
thriving technology ecosystem.
With the new Glendale hub, DAS
US customers benefit from faster spare parts supply,
improved service, and direct access to the company’s
latest innovations. DAS US has been active in the U.S.
since 2014, serving semiconductor and high-tech customers through offices in Boise, Idaho, and Phoenix,
Arizona, along with service locations in Hillsboro,
22 | Wednesday, October 8
Oregon; Lehi, Utah; Fort Collins, Colorado; and Austin,
Texas. The Phoenix office, opened in 2022, has now
been expanded into the new ISC, further underscoring
the company`s long-term commitment to the region
and providing a foundation for future
growth and collaboration with U.S.
partners. Today, DAS US employs
about 40 people nationwide.
“The opening of our Glendale
Innovation & Support Center is a clear
signal of our commitment to the U.S.
market,” said René Reichardt, CEO of
DAS Environmental Experts Group.
“We are investing in Arizona and the
U.S. workforce to ensure we can support our customers
locally with reliable service, spare parts availability, and
hands-on technical expertise. The facility’s tool training
and classroom space provide real-world experience with
a variety of DAS technologies, taking our customer care
to a new level.”
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