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brand of cryopumps
where atomic layer precision is
and Polycold
required, particularly in depocryochillers to the
sition and etch. This creates
Edwards line-up.
new challenges for vacuum
Edwards had already
pumping and process control.
invested in on-tool
“We are entering an interesting
turbopumps with
time because we’re down to
acquisition of Seikothe atomic layer when it comes
Seiki’s magnetically
to etch channels, depth and
levitated (maglev)
aspect ratio. It’s getting harder
turbopump line in
and harder,” Tolner said. “Be2002.
cause the turbopumps and the
Earlier this year,
cryopumps sit so close to the
Edwards formed a
wafer, monitoring, control and
new Semiconductor
consistency become more and
Chamber Solutions
more important.”
Division to better
In some cases, the boundaries
Vacuum pumps such as turbopumps and cryopumps
integrate the CTI/
of the existing pump technology
are found within the tools in the cleanroom.
Polycold products
are being pushed, particularly
Additional roughing pumps and turbobumps are
and technology into located in the subfab below. Source: Solid State
when it comes to pump size.
the Edwards family. Technology.
“Where a typical etch chamber
Martin Tollner,
would normally have a 1,300
President of the new division, spoke
liter per second pump, now they’re
are often employed in the sub-fab
with Semiconductor Digest in adgoing to 4,000 or 5,000 liters per
as well for various applications. The
vance of SEMICON West. “We now
second,” Tollner said. “We’ve seen
sub-fab pumps are connected to
have an entire team within Edwards
that the pumps are having more of an
the tools through a series of lines,
that is purely focused on supporting
influence on the footprint of the tool
called “forelines” because they are
the development of products for
in front of the pump. These are often and on the performance of the tool.”
semiconductor chamber applicaPlasma density is good example of
heated to minimize deposited of
tions, be it from the cryogenic
a process parameter that is directly
Martin Tollner, President, impact by pump performance. “How
side or from the turbopump
Semiconductor Chamber
side,” he said. “That is quite
do we maintain that consistency and
Solutions at Edwards
exciting and because we’re
the constant asymmetrical plasma
Vacuum.
leveraging the experience
density around the wafer when
within Edwards and the expewe’re etching? It’s about control, it’s
process byproducts in the
rience within CTI/Polycold. We’re
about pumping, it’s about the entire
line. Process byproducts can be
really bringing strong investment in
gaseous, solid or liquid, and are often systems,” Tollner said. “We have a
innovation to support the customers
difficult to handle in that they can be lot of tools to simulate and model
and the OEM customers.”
particle-laden and corrosive, or even entire vacuum systems. We provide
Most critical semiconductor
that information and different ideas
toxic, carcinogenic and a danger to
processes such — etch, ion imon how to redesign that, which is
the environment. The byproducts
plantation, physical and chemical
quite exciting.”
are destroyed or diluted to safe
deposition, and EUV — require
The semiconductor industry is also
levels at the end of the line by a gas
high levels of vacuum. This is aclooking employ to a diverse array
abatement system.
complished by a combination of
of new materials in order to boost
New challenges
turbos and/or cryopumps within the
device performance, which can bring
The sophistication of semiconductor
tool, and “roughing” or “backing”
new challenges to vacuum pumping
processes has evolved to the point
pumps in the sub-fab. Turbopumps
in terms of process Continued on page 6
www.semiconductordigest.com
Tuesday, July 21 | 5
